Patent Assignment Details
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Reel/Frame: | 026983/0181 | |
| Pages: | 8 |
| | Recorded: | 09/28/2011 | | |
Attorney Dkt #: | RPS920110036US1 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/02/2014
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Application #:
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13247275
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Filing Dt:
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09/28/2011
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Publication #:
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Pub Dt:
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03/28/2013
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Title:
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Method Of Forming An Overmolded Dual In-Line Memory Module Cooling Structure
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Assignee
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NEW ORCHARD ROAD |
ARMONK, NEW YORK 10504 |
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Correspondence name and address
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IBM (RPS-BLF) C/O BIGGERS & OHANIAN, LLP
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P.O. BOX 1469
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AUSTIN, TX 78767-1469
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