Patent Assignment Details
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| Reel/Frame: | 050214/0181 | |
| Pages: | 3 |
| | Recorded: | 08/29/2019 | | |
| Attorney Dkt #: | 2019-0875A |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/12/2021
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Application #:
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16489790
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Filing Dt:
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08/29/2019
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Publication #:
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Pub Dt:
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01/09/2020
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Title:
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PHOTOSENSITIVE RESIN COMPOSITION, ETCHING METHOD AND PLATING METHOD
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Assignee
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| 2-10-14, RYOGOKU, SUMIDA-KU |
| TOKYO, JAPAN 130-0026 |
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Correspondence name and address
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WENDEROTH, LIND & PONACK, L.L.P.
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1025 CONNECTICUT AVENUE NW
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SUITE 500
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WASHINGTON, DC 20036
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