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Patent Assignment Details
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Reel/Frame:059779/0181   Pages: 4
Recorded: 04/22/2022
Attorney Dkt #:TJKK TO DENSO
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 3
1
Patent #:
Issue Dt:
08/24/2021
Application #:
16189549
Filing Dt:
11/13/2018
Publication #:
Pub Dt:
05/14/2020
Title:
POWER ELECTRONICS MODULES INCLUDING INTEGRATED JET COOLING
2
Patent #:
Issue Dt:
09/14/2021
Application #:
16196780
Filing Dt:
11/20/2018
Publication #:
Pub Dt:
05/21/2020
Title:
COOLING CHIP STRUCTURES HAVING A JET IMPINGEMENT SYSTEM AND ASSEMBLY HAVING THE SAME
3
Patent #:
Issue Dt:
08/24/2021
Application #:
16208819
Filing Dt:
12/04/2018
Publication #:
Pub Dt:
06/04/2020
Title:
COOLING DEVICES INCLUDING A VARIABLE ANGLE CONTACT SURFACE AND METHODS FOR COOLING HEAT-GENERATING DEVICES WITH A COOLING DEVICE
Assignor
1
Exec Dt:
03/09/2022
Assignee
1
1-1 SHOWA-CHO
KARIYA-CITY, AICHI-PREF, JAPAN 448-8661
Correspondence name and address
DINSMORE & SHOHL LLP
900 WILSHIRE DRIVE
SUITE 300
TROY, MI 48084

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