Patent Assignment Details
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Reel/Frame: | 021724/0183 | |
| Pages: | 3 |
| | Recorded: | 10/23/2008 | | |
Attorney Dkt #: | 0033-1242PUS1 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12247080
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Filing Dt:
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10/07/2008
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Publication #:
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Pub Dt:
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04/23/2009
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Title:
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METHOD OF SEALING AND MOLDING ELECTRONIC COMPONENT WITH RESIN AND MOLD
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Assignee
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5, KAMITOBA KAMICHOSHI-CHO, MINAMI-KU |
KYOTO-SHI, KYOTO, JAPAN 601-8105 |
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Correspondence name and address
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BIRCH, STEWART, KOLASCH & BIRCH, LLP.
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P. O. BOX 747
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FALLS CHURCH, VA 22042-0747
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