Total properties:
18
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Patent #:
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Issue Dt:
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01/30/1990
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Application #:
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06887129
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Filing Dt:
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07/17/1986
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Title:
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SEMICONDUCTOR WAFER ARRAY
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Patent #:
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Issue Dt:
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09/04/1990
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Application #:
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07114633
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Filing Dt:
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10/28/1987
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Title:
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SEMICONDUCTOR WAFER ARRAY WITH ELECTRICALLY CONDUCTIVE COMPLIANT MATERIAL
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Patent #:
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Issue Dt:
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10/07/1997
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Application #:
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08265081
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Filing Dt:
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06/23/1994
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Title:
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VERTICAL INTERCONNECT PROCESS FOR SILICON SEGMENTS
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Patent #:
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Issue Dt:
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08/12/1997
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Application #:
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08374421
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Filing Dt:
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01/19/1995
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Title:
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A CONDUCTIVE EXPOXY FLIP-CHIP PACKAGE AND METHOD
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Patent #:
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Issue Dt:
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12/16/1997
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Application #:
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08376149
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Filing Dt:
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01/20/1995
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Title:
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SILICON SEGMENT PROGRAMMING METHOD AND APPARATUS
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Patent #:
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Issue Dt:
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08/26/1997
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Application #:
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08476623
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Filing Dt:
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06/07/1995
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Title:
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VERTICAL INTERCONNECT PROCESS FOR SILICON SEGMENTS
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Patent #:
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Issue Dt:
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10/17/2000
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Application #:
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08834798
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Filing Dt:
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04/03/1997
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Title:
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CONDUCTIVE EPOXY FLIP-CHIP PACKAGE AND METHOD
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Patent #:
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Issue Dt:
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02/13/2001
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Application #:
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08842448
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Filing Dt:
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04/24/1997
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Title:
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VERTICAL INTERCONNECT PROCESS FOR SILICON SEGMENTS
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Patent #:
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Issue Dt:
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11/30/1999
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Application #:
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08845654
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Filing Dt:
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04/25/1997
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Title:
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SILICON SEGMENT PROGRAMMING METHOD
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Patent #:
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Issue Dt:
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08/10/1999
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Application #:
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08845655
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Filing Dt:
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04/25/1997
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Title:
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SPEAKER DIAPHRAGM
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Patent #:
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Issue Dt:
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11/17/1998
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Application #:
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08847309
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Filing Dt:
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04/24/1997
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Title:
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VERTICAL INTERCONNECT PROCESS FOR SILICON SEGMENTS
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Patent #:
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Issue Dt:
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08/08/2000
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Application #:
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08917447
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Filing Dt:
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08/22/1997
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Title:
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METHOD FOR FORMING CONDUCTIVE EPOXY FLIP-CHIP ON CHIP
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Patent #:
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Issue Dt:
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08/07/2001
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Application #:
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08918500
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Filing Dt:
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08/22/1997
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Title:
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CONDUCTIVE EPOXY FLIP-CHIP ON CHIP
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Patent #:
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Issue Dt:
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09/26/2000
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Application #:
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08918501
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Filing Dt:
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08/22/1997
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Title:
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VERTICAL INTERCONNECT PROCESS FOR SILICON SEGMENTS WITH THERMALLY CONDUCTIVE EPOXY PREFORM
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Patent #:
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Issue Dt:
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04/06/1999
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Application #:
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08918502
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Filing Dt:
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08/22/1997
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Title:
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METHOD FOR FORMING VERTICAL INTERCONNECT PROCESS FOR SILICON SEGMENTS WITH THERMALLY CONDUCTIVE EPOXY PREFORM
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Patent #:
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Issue Dt:
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06/27/2000
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Application #:
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08920273
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Filing Dt:
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08/22/1997
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Title:
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METHOD FOR FORMING VERTICAL INTERCONNECT PROCESS FOR SILICON SEGMENTS WITH DIELECTRIC ISOLATION
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Patent #:
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Issue Dt:
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01/23/2001
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Application #:
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09273941
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Filing Dt:
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03/22/1999
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Title:
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METHOD FOR FORMING VERTICAL INTERCONNECT PROCESS FOR SILICON SEGMENTS WITH THERMALLY CONDUCTIVE EPOXY PREFORM
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Patent #:
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Issue Dt:
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02/18/2003
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Application #:
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09495123
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Filing Dt:
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02/01/2000
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Title:
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APPARATUS AND METHOD OF IMPLEMENTING A UNIVERSAL HOME NETWORK ON A CUSTOMER PREMISES ISDN BUS
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