Patent Assignment Details
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Reel/Frame: | 060175/0183 | |
| Pages: | 5 |
| | Recorded: | 06/13/2022 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/15/2023
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Application #:
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17838307
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Filing Dt:
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06/13/2022
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Publication #:
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Pub Dt:
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09/29/2022
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Title:
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METHOD AND STRUCTURE FOR DIE BONDING USING ENERGY BEAM
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Assignee
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21, LI-HSIN RD., SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN 300 |
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Correspondence name and address
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HUAN-YI LIN
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4521 WELLFLEET DR
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HUNTINGTON BEACH, CA 92649
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Search Results as of:
06/24/2024 01:53 AM
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