Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 033010/0184 | |
| Pages: | 8 |
| | Recorded: | 06/02/2014 | | |
| Attorney Dkt #: | ACQ-DONGBU |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
10
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Patent #:
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Issue Dt:
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11/20/2007
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Application #:
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11024701
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Filing Dt:
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12/30/2004
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Publication #:
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Pub Dt:
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03/16/2006
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Title:
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SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
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Patent #:
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Issue Dt:
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06/30/2009
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Application #:
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11567671
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Filing Dt:
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12/06/2006
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Publication #:
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Pub Dt:
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06/14/2007
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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02/01/2011
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Application #:
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11831515
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Filing Dt:
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07/31/2007
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Publication #:
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Pub Dt:
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02/28/2008
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Title:
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SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
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Patent #:
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Issue Dt:
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06/01/2010
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Application #:
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11831539
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Filing Dt:
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07/31/2007
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Publication #:
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Pub Dt:
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02/14/2008
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Title:
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SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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06/30/2009
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Application #:
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11863357
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Filing Dt:
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09/28/2007
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Publication #:
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Pub Dt:
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06/12/2008
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Title:
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WAFER BONDING METHOD OF SYSTEM IN PACKAGE
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Patent #:
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Issue Dt:
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11/08/2011
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Application #:
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12140558
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Filing Dt:
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06/17/2008
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Publication #:
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Pub Dt:
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12/25/2008
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Title:
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METHOD OF FORMING METAL ELECTRODE OF SYSTEM IN PACKAGE
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Patent #:
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Issue Dt:
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10/18/2011
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Application #:
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12169031
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Filing Dt:
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07/08/2008
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Publication #:
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Pub Dt:
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01/15/2009
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Title:
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SEMICONDUCTOR CHIP, METHOD OF FABRICATING THE SAME AND STACK PACKAGE HAVING THE SAME
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Patent #:
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Issue Dt:
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06/28/2011
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Application #:
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12334508
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Filing Dt:
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12/14/2008
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Publication #:
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Pub Dt:
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06/25/2009
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Title:
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SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
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Patent #:
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Issue Dt:
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01/04/2011
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Application #:
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12340273
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Filing Dt:
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12/19/2008
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Publication #:
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Pub Dt:
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06/25/2009
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Title:
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SEMICONDUCTOR CHIP, METHOD OF FABRICATING THE SAME AND SEMICONDUCTOR CHIP STACK PACKAGE
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Patent #:
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Issue Dt:
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10/04/2011
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Application #:
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12470702
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Filing Dt:
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05/22/2009
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Publication #:
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Pub Dt:
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09/24/2009
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Title:
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MULTI-LAYERED METAL INTERCONNECTION
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Assignee
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| 15320 SE BARON LOOP |
| HAPPY VALLEY, OREGON 97086 |
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Correspondence name and address
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CHRISTOPHER LATTIN
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3025 ORCHARD PARKWAY
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SAN JOSE, CA 95134
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