Patent Assignment Details
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Reel/Frame: | 030018/0185 | |
| Pages: | 3 |
| | Recorded: | 03/15/2013 | | |
Attorney Dkt #: | SYN-2119 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/06/2014
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Application #:
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13838845
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Filing Dt:
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03/15/2013
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Title:
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COMPACT AND ACCURATE WAFER TOPOGRAPHY PROXIMITY EFFECT MODELING FOR FULL CHIP SIMULATION
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Assignee
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700 EAST MIDDLEFIELD RD., BLDG. C |
MOUNTAIN VIEW, CALIFORNIA 94043 |
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Correspondence name and address
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BEVER, HOFFMAN & HARMS, LLP
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901 CAMPISI WAY
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SUITE 370
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CAMPBELL, CA 95008
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