Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 041085/0189 | |
| Pages: | 3 |
| | Recorded: | 01/25/2017 | | |
| Attorney Dkt #: | BDGE-I19C3 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
15415844
|
Filing Dt:
|
01/25/2017
|
|
Publication #:
|
|
Pub Dt:
|
05/11/2017
| | | | |
|
Title:
|
THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHOD OF MAKING THE SAME
|
|
|
Assignee
|
|
|
|
|
| 3FL., 157 LI-TE ROAD, PEITOU DIST. |
| TAIPEI, TAIWAN 11259 |
|
|
Correspondence name and address
|
| |
CHAO-CHANG DAVID PAI
|
| |
1001 FOURTH AVENUE, SUITE 3200
|
| |
SEATTLE, WA 98154
|
Search Results as of:
06/17/2024 01:41 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
