Patent Assignment Details
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| Reel/Frame: | 067471/0189 | |
| Pages: | 3 |
| | Recorded: | 05/21/2024 | | |
| Attorney Dkt #: | 35044-108CON2 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18669577
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Filing Dt:
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05/21/2024
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Publication #:
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Pub Dt:
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09/19/2024
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Title:
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SEMICONDUCTOR DIE INCLUDING GUARD RING STRUCTURE AND THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING THE SAME
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Assignee
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| NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN ROC 30077 |
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Correspondence name and address
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WHITNEY MCNEIL
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THE MARBURY LAW GROUP, PLLC
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11800 SUNRISE VALLEY DRIVE, 15TH FLOOR
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RESTON, VA 20191
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