Patent Assignment Details
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Reel/Frame: | 039553/0190 | |
| Pages: | 6 |
| | Recorded: | 08/26/2016 | | |
Attorney Dkt #: | 70027-1900 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/09/2018
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Application #:
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14955033
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Filing Dt:
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11/30/2015
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Publication #:
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Pub Dt:
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04/07/2016
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH UNDER BUMP METALLIZATION AND METHOD OF MANUFACTURE THEREOF
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Assignee
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10 ANG MO KIO STREET 65 |
#05-17/20 TECHPOINT |
SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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WONG & REES LLP
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4677 OLD IRONSIDES DRIVE
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SUITE 370
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SANTA CLARA, CA 95054
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