Patent Assignment Details
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Reel/Frame: | 020135/0191 | |
| Pages: | 3 |
| | Recorded: | 11/19/2007 | | |
Attorney Dkt #: | 9898-620 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11942529
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Filing Dt:
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11/19/2007
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Publication #:
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Pub Dt:
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05/29/2008
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Title:
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METHOD OF FORMING METAL LAYER WIRING STRUCTURE ON BACKSIDE OF WAFER, METAL LAYER WIRING STRUCTURE FORMED USING THE METHOD, METHOD OF STACKING CHIP PACKAGE, AND CHIP PACKAGE STACK STRUCTURE FORMED USING THE METHOD
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Assignee
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416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, |
GYEONGGI-DO, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF |
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Correspondence name and address
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MARGER JOHNSON & MCCOLLOM, P.C.
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210 SW MORRISON STREET, SUITE 400
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PORTLAND, OR 97204
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