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Reel/Frame:067920/0192   Pages: 3
Recorded: 07/05/2024
Attorney Dkt #:133039-5001-US
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
03/25/2025
Application #:
17773293
Filing Dt:
04/29/2022
Publication #:
Pub Dt:
05/09/2024
Title:
SUBSTRATE STRIPPING METHOD AND EPITAXIAL WAFER
Assignors
1
Exec Dt:
04/01/2024
2
Exec Dt:
04/01/2024
3
Exec Dt:
04/01/2024
4
Exec Dt:
04/01/2024
Assignee
1
233, SUFU ROAD, SUXI TOWN, YIWU
JINHUA, CHINA 322000
Correspondence name and address
DION M. BREGMAN
1400 PAGE MILL ROAD
PALO ALTO, CA 94304

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