Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 008346/0193 | |
| Pages: | 2 |
| | Recorded: | 11/18/1996 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/02/1999
|
Application #:
|
08749963
|
Filing Dt:
|
11/18/1996
|
|
Title:
|
PLATE AND COLUMN TYPE SEMICONDUCTOR PACKAGE HAVING HEAT SINK
|
|
|
Assignee
|
|
|
|
|
| 1, HYANGJEONG-DONG, HUNGDUK-GU, CHEONGJU |
| CHOONGCHEONGBUK-DO, KOREA, REPUBLIC OF 360-4 |
|
|
Correspondence name and address
|
| |
FLESHNER & KIM
|
| |
DANIEL Y. J. KIM
|
| |
8229 BOONE BOULEVARD, SUITE 840
|
| |
VIENNA, VA 22182
|
Search Results as of:
06/25/2024 07:14 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
