Patent Assignment Details
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Reel/Frame: | 040071/0193 | |
| Pages: | 3 |
| | Recorded: | 09/19/2016 | | |
Attorney Dkt #: | 2013P00725US01 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/27/2016
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Application #:
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14901705
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Filing Dt:
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12/28/2015
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Publication #:
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Pub Dt:
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11/10/2016
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Title:
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Bonding LED Die to Lead Frame Strips
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Assignee
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HIGH TECH CAMPUS 5 |
EINDHOVEN, NETHERLANDS 5656 AE |
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Correspondence name and address
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PATENT LAW GROUP LLP
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P.O. BOX 61839
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SUNNYVALE, CA 94088
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