Patent Assignment Details
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| Reel/Frame: | 013588/0197 | |
| Pages: | 5 |
| | Recorded: | 12/19/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10001314
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Filing Dt:
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11/14/2001
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Publication #:
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Pub Dt:
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09/26/2002
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Title:
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Method for forming isolation layer of semiconductor device
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Assignee
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| 11 F, DOOSAN BLDG., 838, |
| YUKSAMDONG, KANGNAM-GU |
| SEOUL, 135-080, KOREA, REPUBLIC OF |
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Correspondence name and address
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WILDMAN, HARROLD, ALLEN & DIXON
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TIMOTHY J. KEEFER
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225 WEST WACKER DRIVE
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CHICAGO, IL 60606
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