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NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:	029586/0197			Pages:	11
		Recorded:	01/08/2013
Conveyance:	SECURITY AGREEMENT

Total properties: 39

Patent #:	6761211	Issue Dt:	07/13/2004	Application #:	09872678	Filing Dt:	06/01/2001
Publication #:	US20010045270	Pub Dt:	11/29/2001
Title:	HIGH-PERFORMANCE HEAT SINK FOR ELECTRONICS COOLING

Patent #:	6422307	Issue Dt:	07/23/2002	Application #:	09908327	Filing Dt:	07/18/2001
Title:	ULTRA HIGH FIN DENSITY HEAT SINK FOR ELECTRONICS COOLING

Patent #:	6687142	Issue Dt:	02/03/2004	Application #:	10016678	Filing Dt:	12/17/2001
Publication #:	US20030112646	Pub Dt:	06/19/2003
Title:	AC TO DC INVERTER FOR USE WITH AC SYNCHRONOUS MOTORS

Patent #:	6725682	Issue Dt:	04/27/2004	Application #:	10025846	Filing Dt:	12/26/2001
Publication #:	US20030010050	Pub Dt:	01/16/2003
Title:	COMPUTER COOLING APPARATUS

Patent #:	6591897	Issue Dt:	07/15/2003	Application #:	10079214	Filing Dt:	02/20/2002
Title:	HIGH PERFORMANCE PIN FIN HEAT SINK FOR ELECTRONICS COOLING

Patent #:	6668910	Issue Dt:	12/30/2003	Application #:	10119911	Filing Dt:	04/09/2002
Publication #:	US20030188849	Pub Dt:	10/09/2003
Title:	HEAT SINK WITH MULTIPLE SURFACE ENHANCEMENTS

Patent #:	6588498	Issue Dt:	07/08/2003	Application #:	10198321	Filing Dt:	07/18/2002
Title:	THERMOSIPHON FOR ELECTRONICS COOLING WITH HIGH PERFORMANCE BOILING AND CONDENSING SURFACES

Patent #:	6840311	Issue Dt:	01/11/2005	Application #:	10374346	Filing Dt:	02/25/2003
Publication #:	US20040163798	Pub Dt:	08/26/2004
Title:	COMPACT THERMOSIPHON FOR DISSIPATING HEAT GENERATED BY ELECTRONIC COMPONENTS

Patent #:	6695039	Issue Dt:	02/24/2004	Application #:	10374349	Filing Dt:	02/25/2003
Title:	ORIENTATION INSENSITIVE THERMOSIPHON ASSEMBLY FOR COOLING ELECTRONIC COMPONENTS

Patent #:	7739883	Issue Dt:	06/22/2010	Application #:	10483500	Filing Dt:	11/22/2005
Publication #:	US20080041566	Pub Dt:	02/21/2008
Title:	COMPUTER COOLING APPARATUS

Patent #:	6850097	Issue Dt:	02/01/2005	Application #:	10681225	Filing Dt:	10/09/2003
Publication #:	US20040120170	Pub Dt:	06/24/2004
Title:	INVERTER

Patent #:	6971243	Issue Dt:	12/06/2005	Application #:	10710792	Filing Dt:	08/03/2004
Publication #:	US20050045313	Pub Dt:	03/03/2005
Title:	HEAT SINK

Patent #:	7174738	Issue Dt:	02/13/2007	Application #:	10757493	Filing Dt:	01/15/2004
Publication #:	US20050081532	Pub Dt:	04/21/2005
Title:	COMPUTER COOLING APPARATUS

Patent #:	7537151	Issue Dt:	05/26/2009	Application #:	11033334	Filing Dt:	01/11/2005
Publication #:	US20050156013	Pub Dt:	07/21/2005
Title:	METHOD OF MAKING HIGH PERFORMANCE HEAT SINKS

Patent #:	7077189	Issue Dt:	07/18/2006	Application #:	11040321	Filing Dt:	01/21/2005
Publication #:	US20060162898	Pub Dt:	07/27/2006
Title:	LIQUID COOLED THERMOSIPHON WITH FLEXIBLE COOLANT TUBES

Patent #:	7604040	Issue Dt:	10/20/2009	Application #:	11153107	Filing Dt:	06/15/2005
Publication #:	US20060283579	Pub Dt:	12/21/2006
Title:	INTEGRATED LIQUID COOLED HEAT SINK FOR ELECTRONIC COMPONENTS

Patent #:	7331380	Issue Dt:	02/19/2008	Application #:	11205338	Filing Dt:	08/17/2005
Publication #:	US20070039720	Pub Dt:	02/22/2007
Title:	RADIAL FLOW MICRO-CHANNEL HEAT SINK WITH IMPINGEMENT COOLING

Patent #:	7461690	Issue Dt:	12/09/2008	Application #:	11236019	Filing Dt:	09/27/2005
Publication #:	US20070068666	Pub Dt:	03/29/2007
Title:	OPTIMALLY SHAPED SPREADER PLATE FOR ELECTRONICS COOLING ASSEMBLY

Patent #:	7278468	Issue Dt:	10/09/2007	Application #:	11242738	Filing Dt:	10/04/2005
Publication #:	US20070074849	Pub Dt:	04/05/2007
Title:	HEAT SINK WITH MULTIPLE COOLANT INLETS

Patent #:	7331378	Issue Dt:	02/19/2008	Application #:	11333655	Filing Dt:	01/17/2006
Publication #:	US20070163750	Pub Dt:	07/19/2007
Title:	MICROCHANNEL HEAT SINK

Patent #:	7556089	Issue Dt:	07/07/2009	Application #:	11395697	Filing Dt:	03/31/2006
Publication #:	US20070227702	Pub Dt:	10/04/2007
Title:	LIQUID COOLED THERMOSIPHON WITH CONDENSER COIL RUNNING IN AND OUT OF LIQUID REFRIGERANT

Patent #:	7422052	Issue Dt:	09/09/2008	Application #:	11407452	Filing Dt:	04/20/2006
Publication #:	US20070246197	Pub Dt:	10/25/2007
Title:	LOW PROFILE THERMOSIPHON

Patent #:	7520317	Issue Dt:	04/21/2009	Application #:	11434645	Filing Dt:	05/16/2006
Publication #:	US20070267182	Pub Dt:	11/22/2007
Title:	ORIENTATION INSENSITIVE COMPACT THERMOSIPHON WITH A REMOTE AUXILIARY CONDENSER

Patent #:	7597135	Issue Dt:	10/06/2009	Application #:	11439042	Filing Dt:	05/23/2006
Publication #:	US20070272392	Pub Dt:	11/29/2007
Title:	IMPINGEMENT COOLED HEAT SINK WITH LOW PRESSURE DROP

Patent #:	7467657	Issue Dt:	12/23/2008	Application #:	11448591	Filing Dt:	06/07/2006
Publication #:	US20070284094	Pub Dt:	12/13/2007
Title:	COMPACT MODULAR CPU COOLING UNIT

Patent #:	7477516	Issue Dt:	01/13/2009	Application #:	11505724	Filing Dt:	08/17/2006
Publication #:	US20080043433	Pub Dt:	02/21/2008
Title:	AIR COOLED COMPUTER CHIP

Patent #:	7475718	Issue Dt:	01/13/2009	Application #:	11599942	Filing Dt:	11/15/2006
Publication #:	US20080110599	Pub Dt:	05/15/2008
Title:	ORIENTATION INSENSITIVE MULTI CHAMBER THERMOSIPHON

Patent #:	7934540	Issue Dt:	05/03/2011	Application #:	11701213	Filing Dt:	02/01/2007
Publication #:	US20080185129	Pub Dt:	08/07/2008
Title:	INTEGRATED LIQUID COOLING UNIT FOR COMPUTERS

Patent #:	7556088	Issue Dt:	07/07/2009	Application #:	11731202	Filing Dt:	03/30/2007
Publication #:	US20080236788	Pub Dt:	10/02/2008
Title:	THERMOSIPHON FOR LAPTOP COMPUTER

Patent #:	7650928	Issue Dt:	01/26/2010	Application #:	11731204	Filing Dt:	03/30/2007
Publication #:	US20080236789	Pub Dt:	10/02/2008
Title:	HIGH PERFORMANCE COMPACT THERMOSIPHON WITH INTEGRATED BOILER PLATE

Patent #:	7497249	Issue Dt:	03/03/2009	Application #:	11731641	Filing Dt:	03/30/2007
Publication #:	US20080236790	Pub Dt:	10/02/2008
Title:	THERMOSIPHON FOR LAPTOP COMPUTER

Patent #:	8382456	Issue Dt:	02/26/2013	Application #:	11745932	Filing Dt:	05/08/2007
Publication #:	US20080236799	Pub Dt:	10/02/2008
Title:	PUMP EXPANSION VESSEL

Patent #:	7770632	Issue Dt:	08/10/2010	Application #:	11904115	Filing Dt:	09/26/2007
Publication #:	US20090078396	Pub Dt:	03/26/2009
Title:	THERMOSIPHON FOR LAPTOP COMPUTERS COMPRISING A BOILING CHAMBER WITH A SQUARE WAVE PARTITION

Patent #:	7991515	Issue Dt:	08/02/2011	Application #:	11969766	Filing Dt:	01/04/2008
Publication #:	US20080186670	Pub Dt:	08/07/2008
Title:	COMPUTER COOLING SYSTEM WITH PREFERENTIAL COOLING DEVICE SELECTION

Patent #:	8746330	Issue Dt:	06/10/2014	Application #:	12189476	Filing Dt:	08/11/2008
Publication #:	US20090071625	Pub Dt:	03/19/2009
Title:	FLUID HEAT EXCHANGER CONFIGURED TO PROVIDE A SPLIT FLOW

Patent #:	8120919	Issue Dt:	02/21/2012	Application #:	12646490	Filing Dt:	12/23/2009
Publication #:	US20110149506	Pub Dt:	06/23/2011
Title:	ADJUSTABLE MOUNTING BRACKET FOR A COMPUTER COMPONENT

Patent #:	9055697	Issue Dt:	06/09/2015	Application #:	12813701	Filing Dt:	06/11/2010
Publication #:	US20100286843	Pub Dt:	11/11/2010
Title:	AIR CONDITIONING SYSTEM CONTROL

Patent #:	9453691	Issue Dt:	09/27/2016	Application #:	13401618	Filing Dt:	02/21/2012
Publication #:	US20120152498	Pub Dt:	06/21/2012
Title:	FLUID HEAT EXCHANGE SYSTEMS

Patent #:	D582918	Issue Dt:	12/16/2008	Application #:	29248900	Filing Dt:	09/08/2006
Title:	COMPUTER DEVICE MOUNTING CLIP

Assignor

COOLIT SYSTEMS INC.

Exec Dt:

11/07/2012

Assignee

COMERICA BANK, A TEXAS BANKING ASSOCIATION AND AUTHORIZED FOREIGN BANK UNDER THE BANK ACT (CANADA)

200 BAY STREET, SUITE 2210, SOUTH TOWER

ROYAL BANK PLAZA, P.O. BOX 61

TORONTO, ONTARIO, CANADA M5J 2J2

Correspondence name and address
	ANGELA ALVAREZ SUJEK - BODMAN PLC
	201 SOUTH DIVISION, SUITE 400
	ANN ARBOR, MI 48104

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