Patent Assignment Details
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| Reel/Frame: | 048848/0197 | |
| Pages: | 3 |
| | Recorded: | 04/10/2019 | | |
| Attorney Dkt #: | 184474/1173-605 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/12/2020
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Application #:
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16278539
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Filing Dt:
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02/18/2019
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Title:
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INTEGRATED CIRCUIT (IC) INTERCONNECT STRUCTURE HAVING A METAL LAYER WITH ASYMMETRIC METAL LINE-DIELECTRIC STRUCTURES SUPPORTING SELF-ALIGNED VERTICAL INTERCONNECT ACCESSES (VIAS)
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Assignee
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121 |
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Correspondence name and address
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W&T/QUALCOMM
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106 PINEDALE SPRINGS WAY
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CARY, NC 27511
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06/18/2024 04:51 PM
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