Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 036569/0198 | |
| Pages: | 8 |
| | Recorded: | 09/15/2015 | | |
| Attorney Dkt #: | 205504-0007-00-US-531760 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/20/2017
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Application #:
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14777196
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Filing Dt:
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09/15/2015
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Publication #:
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Pub Dt:
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02/11/2016
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Title:
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SOLDERING DEVICE, SOLDERING METHOD, AND SUBSTRATE AND ELECTRONIC COMPONENT PRODUCED BY THE SOLDERING DEVICE OR THE SOLDERING METHOD
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Assignee
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| 1100, SHIOBARA |
| NASUSHIOBARA-SHI, TOCHIGI, JAPAN 329-2921 |
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Correspondence name and address
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DRINKER BIDDLE & REATH (DC)
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1500 K STREET, N.W.
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SUITE 1100
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WASHINGTON, DC 20005-1209
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