Patent Assignment Details
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Reel/Frame: | 054909/0198 | |
| Pages: | 4 |
| | Recorded: | 01/13/2021 | | |
Attorney Dkt #: | SH20420HI |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/13/2023
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Application #:
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17148147
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Filing Dt:
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01/13/2021
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Publication #:
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Pub Dt:
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02/10/2022
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Title:
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SEMICONDUCTOR DEVICE HAVING WAFER-TO-WAFER BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
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Assignee
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2091, GYEONGCHUNG-DAERO, BUBAL-EUB |
GYEONGGI-DO |
ICHEON-SI, KOREA, REPUBLIC OF 17336 |
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Correspondence name and address
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AGORA LAW, LLC
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21732 38TH DR SE
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BOTHELL, WA 98021
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09/22/2024 04:39 PM
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