Patent Assignment Details
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Reel/Frame: | 055745/0199 | |
| Pages: | 4 |
| | Recorded: | 03/29/2021 | | |
Attorney Dkt #: | 107960-US-1097-PCT(CA) |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/24/2023
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Application #:
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17211871
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Filing Dt:
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03/25/2021
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Publication #:
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Pub Dt:
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07/08/2021
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Title:
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METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR SUBSTRATE
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Assignee
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1-310, 42-1, BESSHO 1-CHOME, HACHIOJI-SHI, |
TOKYO, JAPAN 1920363 |
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Correspondence name and address
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JCIPRNET
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8F-1, NO. 100, ROOSEVELT RD. SEC. 2,
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TAIPEI, 100404 TAIWAN
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09/23/2024 02:51 PM
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