Patent Assignment Details
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| Reel/Frame: | 059347/0199 | |
| Pages: | 11 |
| | Recorded: | 03/23/2022 | | |
| Attorney Dkt #: | AOS-P153 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17701695
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Filing Dt:
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03/23/2022
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Publication #:
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Pub Dt:
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09/28/2023
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Title:
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CHIP SCALE PACKAGE (CSP) SEMICONDUCTOR DEVICE HAVING THIN SUBSTRATE
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Assignee
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| 100 KING STREET WEST, SUITE # 6000 |
| TORONTO, CANADA ONTARIO M5X 1E2 |
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Correspondence name and address
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CHEN-CHI LIN
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1119 QUAIL CREEK CIRCLE
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SAN JOSE, CA 95120
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06/19/2024 04:17 PM
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