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NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:	037406/0200			Pages:	12
		Recorded:	12/30/2015
Conveyance:	MERGER (SEE DOCUMENT FOR DETAILS).

Total properties: 63

Patent #:	4490626	Issue Dt:	12/25/1984	Application #:	06403004	Filing Dt:	07/29/1982
Title:	MULTIPLEXER CIRCUITRY FOR HIGH DENSITY ANALOG SIGNALS

Patent #:	RE33331	Issue Dt:	09/11/1990	Application #:	07336017	Filing Dt:	04/10/1989
Title:	MULTIPLEXER CIRCUITRY FOR HIGH DENSITY ANALOG SIGNALS

Patent #:	5635705	Issue Dt:	06/03/1997	Application #:	08526415	Filing Dt:	09/11/1995
Title:	SENSING AND SELECTING OBSERVED EVENTS FOR SIGNAL PROCESSING

Patent #:	5953588	Issue Dt:	09/14/1999	Application #:	08777747	Filing Dt:	12/21/1996
Title:	STACKABLE LAYERS CONTAINING ENCAPSULATED IC CHIPS

Patent #:	6195268	Issue Dt:	02/27/2001	Application #:	09031435	Filing Dt:	02/26/1998
Title:	STACKING LAYERS CONTAINING ENCLOSED IC CHIPS

Patent #:	6028352	Issue Dt:	02/22/2000	Application #:	09095415	Filing Dt:	06/10/1998
Title:	IC STACK UTILIZING SECONDARY LEADFRAMES

Patent #:	6014316	Issue Dt:	01/11/2000	Application #:	09095416	Filing Dt:	06/10/1998
Title:	IC STACK UTILIZING BGA CONTACTS

Patent #:	5955668	Issue Dt:	09/21/1999	Application #:	09166458	Filing Dt:	10/05/1998
Title:	MULTI- ELEMENT MICRO GYRO

Patent #:	6089089	Issue Dt:	07/18/2000	Application #:	09301847	Filing Dt:	04/29/1999
Title:	MULTI-ELEMENT MICRO GYRO

Patent #:	6072234	Issue Dt:	06/06/2000	Application #:	09316740	Filing Dt:	05/21/1999
Title:	STACK OF EQUAL LAYER NEO-CHIPS CONTAINING ENCAPSULATED IC CHIPS OF DIFFERENT SIZES

Patent #:	6650704	Issue Dt:	11/18/2003	Application #:	09427384	Filing Dt:	10/25/1999
Title:	METHOD OF PRDUCING A HIGH QUALITY, HIGH RESOLUTION IMAGE FROM A SEQUENCE OF LOW QUALITY, LOW RESOLUTION IMAGES THAT ARE UNDERSAMPLED AND SUBJECT TO JITTER

Patent #:	6578420	Issue Dt:	06/17/2003	Application #:	09604782	Filing Dt:	06/26/2000
Title:	MULTI-AXIS MICRO GYRO STRUCTURE

Patent #:	6370937	Issue Dt:	04/16/2002	Application #:	09812147	Filing Dt:	03/19/2001
Publication #:	US20010039834	Pub Dt:	11/15/2001
Title:	METHOD OF CANCELING QUADRATURE ERROR IN AN ANGULAR RATE SENSOR

Patent #:	6513380	Issue Dt:	02/04/2003	Application #:	09884880	Filing Dt:	06/19/2001
Publication #:	US20020189352	Pub Dt:	12/19/2002
Title:	MEMS SENSOR WITH SINGLE CENTRAL ANCHOR AND MOTION-LIMITING CONNECTION GEOMETRY

Patent #:	6715352	Issue Dt:	04/06/2004	Application #:	09893329	Filing Dt:	06/26/2001
Publication #:	US20030000305	Pub Dt:	01/02/2003
Title:	METHOD OF DESIGNING A FLEXURE SYSTEM FOR TUNING THE MODAL RESPONSE OF A DECOUPLED MICROMACHINED GYROSCOPE AND A GYROSCOPED DESIGNED ACCORDING TO THE METHOD

Patent #:	6596997	Issue Dt:	07/22/2003	Application #:	09921525	Filing Dt:	08/03/2001
Publication #:	US20030025083	Pub Dt:	02/06/2003
Title:	RETRO-REFLECTOR WARM STOP FOR UNCOOLED THERMAL IMAGING CAMERAS AND METHOD OF USING THE SAME

Patent #:	6797537	Issue Dt:	09/28/2004	Application #:	09938686	Filing Dt:	10/30/2001
Publication #:	US20030080419	Pub Dt:	05/01/2003
Title:	METHOD OF MAKING STACKABLE LAYERS CONTAINING ENCAPSULATED INTEGRATED CIRCUIT CHIPS WITH ONE OR MORE OVERLAYING INTERCONNECT LAYERS

Patent #:	6734370	Issue Dt:	05/11/2004	Application #:	09948950	Filing Dt:	09/07/2001
Publication #:	US20030047353	Pub Dt:	03/13/2003
Title:	MULTILAYER MODULES WITH FLEXIBLE SUBSTRATES

Patent #:	6560109	Issue Dt:	05/06/2003	Application #:	09949024	Filing Dt:	09/07/2001
Publication #:	US20030048609	Pub Dt:	03/13/2003
Title:	STACK OF MULTILAYER MODULES WITH HEAT-FOCUSSING METAL LAYER

Patent #:	6717061	Issue Dt:	04/06/2004	Application #:	09949512	Filing Dt:	09/07/2001
Publication #:	US20030049424	Pub Dt:	03/13/2003
Title:	STACKING OF MULTILAYER MODULES

Patent #:	6829237	Issue Dt:	12/07/2004	Application #:	09973857	Filing Dt:	10/09/2001
Publication #:	US20020159449	Pub Dt:	10/31/2002
Title:	HIGH SPEED MULTI-STAGE SWITCHING NETWORK FORMED FROM STACKED SWITCHING LAYERS

Patent #:	6731121	Issue Dt:	05/04/2004	Application #:	10110889	Filing Dt:	08/19/2002
Title:	HIGHLY CONFIGUARABLE CAPACITIVE TRANSDUCER INTERFACE CIRCUIT

Patent #:	6806559	Issue Dt:	10/19/2004	Application #:	10128728	Filing Dt:	04/22/2002
Publication #:	US20030197253	Pub Dt:	10/23/2003
Title:	METHOD AND APPARATUS FOR CONNECTING VERTICALLY STACKED INTEGRATED CIRCUIT CHIPS

Patent #:	6706971	Issue Dt:	03/16/2004	Application #:	10142557	Filing Dt:	05/10/2002
Publication #:	US20020126459	Pub Dt:	09/12/2002
Title:	STACKABLE MICROCIRCUIT LAYER FORMED FROM A PLASTIC ENCAPSULATED MICROCIRCUIT AND METHOD OF MAKING THE SAME

Patent #:	8934627	Issue Dt:	01/13/2015	Application #:	10178390	Filing Dt:	06/24/2002
Publication #:	US20030009773	Pub Dt:	01/09/2003
Title:	Video event capture, storage and processing method and apparatus

Patent #:	6784547	Issue Dt:	08/31/2004	Application #:	10302680	Filing Dt:	11/21/2002
Publication #:	US20030127735	Pub Dt:	07/10/2003
Title:	STACKABLE LAYERS CONTAINING ENCAPSULATED INTEGRATED CIRCUIT CHIPS WITH ONE OR MORE OVERLYING INTERCONNECT LAYERS AND A METHOD OF MAKING THE SAME

Patent #:	7082591	Issue Dt:	07/25/2006	Application #:	10346363	Filing Dt:	01/17/2003
Publication #:	US20040040005	Pub Dt:	02/26/2004
Title:	METHOD FOR EFFECTIVELY EMBEDDING VARIOUS INTEGRATED CIRCUITS WITHIN FIELD PROGRAMMABLE GATE ARRAYS

Patent #:	6856167	Issue Dt:	02/15/2005	Application #:	10347038	Filing Dt:	01/17/2003
Publication #:	US20030223295	Pub Dt:	12/04/2003
Title:	FIELD PROGRAMMABLE GATE ARRAY WITH A VARIABLY WIDE WORD WIDTH MEMORY

Patent #:	6967411	Issue Dt:	11/22/2005	Application #:	10360244	Filing Dt:	02/07/2003
Publication #:	US20040004286	Pub Dt:	01/08/2004
Title:	STACKABLE LAYERS CONTAINING BALL GRID ARRAY PACKAGES

Patent #:	7127807	Issue Dt:	10/31/2006	Application #:	10431914	Filing Dt:	05/07/2003
Publication #:	US20040040743	Pub Dt:	03/04/2004
Title:	MULTILAYER MODULES WITH FLEXIBLE SUBSTRATES

Patent #:	7417323	Issue Dt:	08/26/2008	Application #:	10703177	Filing Dt:	11/06/2003
Publication #:	US20040147064	Pub Dt:	07/29/2004
Title:	NEO-WAFER DEVICE AND METHOD

Patent #:	7239012	Issue Dt:	07/03/2007	Application #:	10951990	Filing Dt:	09/28/2004
Publication #:	US20050037540	Pub Dt:	02/17/2005
Title:	THREE-DIMENSIONAL MODULE COMPRISED OF LAYERS CONTAINING IC CHIPS WITH OVERLYING INTERCONNECT LAYERS

Patent #:	7440449	Issue Dt:	10/21/2008	Application #:	10960712	Filing Dt:	10/06/2004
Publication #:	US20050058128	Pub Dt:	03/17/2005
Title:	HIGH SPEED SWITCHING MODULE COMPRISED OF STACKED LAYERS INCORPORATING T-CONNECT STRUCTURES

Patent #:	7872339	Issue Dt:	01/18/2011	Application #:	10968572	Filing Dt:	10/19/2004
Publication #:	US20050077621	Pub Dt:	04/14/2005
Title:	VERTICALLY STACKED PRE-PACKAGED INTEGRATED CIRCUIT CHIPS

Patent #:	7265579	Issue Dt:	09/04/2007	Application #:	11037490	Filing Dt:	01/18/2005
Publication #:	US20050122758	Pub Dt:	06/09/2005
Title:	FIELD PROGRAMMABLE GATE ARRAY INCORPORATING DEDICATED MEMORY STACKS

Patent #:	7511369	Issue Dt:	03/31/2009	Application #:	11062507	Filing Dt:	02/22/2005
Publication #:	US20070158805	Pub Dt:	07/12/2007
Title:	BGA-SCALE STACKS COMPRISED OF LAYERS CONTAINING INTEGRATED CIRCUIT DIE AND A METHOD FOR MAKING THE SAME

Patent #:	7786562	Issue Dt:	08/31/2010	Application #:	11150712	Filing Dt:	06/10/2005
Publication #:	US20050277288	Pub Dt:	12/15/2005
Title:	STACKABLE SEMICONDUCTOR CHIP LAYER COMPRISING PREFABRICATED TRENCH INTERCONNECT VIAS

Patent #:	7335576	Issue Dt:	02/26/2008	Application #:	11197828	Filing Dt:	08/05/2005
Publication #:	US20060079072	Pub Dt:	04/13/2006
Title:	METHOD FOR PRECISION INTEGRATED CIRCUIT DIE SINGULATION USING DIFFERENTIAL ETCH RATES

Patent #:	7242082	Issue Dt:	07/10/2007	Application #:	11229351	Filing Dt:	09/15/2005
Publication #:	US20060055039	Pub Dt:	03/16/2006
Title:	STACKABLE LAYER CONTAINING BALL GRID ARRAY PACKAGE

Patent #:	8074082	Issue Dt:	12/06/2011	Application #:	11248659	Filing Dt:	10/11/2005
Publication #:	US20060087883	Pub Dt:	04/27/2006
Title:	ANTI-TAMPER MODULE

Patent #:	7198965	Issue Dt:	04/03/2007	Application #:	11354370	Filing Dt:	02/14/2006
Publication #:	US20060134835	Pub Dt:	06/22/2006
Title:	METHOD FOR MAKING A NEO-LAYER COMPRISING EMBEDDED DISCRETE COMPONENTS

Patent #:	7516339	Issue Dt:	04/07/2009	Application #:	11415891	Filing Dt:	05/01/2006
Publication #:	US20070074056	Pub Dt:	03/29/2007
Title:	LOW POWER ELECTRONIC CIRCUIT INCORPORATING REAL TIME CLOCK

Patent #:	7822549	Issue Dt:	10/26/2010	Application #:	11429468	Filing Dt:	05/05/2006
Publication #:	US20100211351	Pub Dt:	08/19/2010
Title:	GLOBAL POSITIONING USING PLANETARY CONSTANTS

Patent #:	7768113	Issue Dt:	08/03/2010	Application #:	11441908	Filing Dt:	05/26/2006
Publication #:	US20060267213	Pub Dt:	11/30/2006
Title:	STACKABLE TIER STRUCTURE COMPRISING PREFABRICATED HIGH DENSITY FEEDTHROUGH

Patent #:	7823403	Issue Dt:	11/02/2010	Application #:	11511117	Filing Dt:	08/26/2006
Publication #:	US20070048154	Pub Dt:	03/01/2007
Title:	MEMS COOLING DEVICE

Patent #:	7919844	Issue Dt:	04/05/2011	Application #:	11524090	Filing Dt:	09/20/2006
Publication #:	US20070035033	Pub Dt:	02/15/2007
Title:	TIER STRUCTURE WITH TIER FRAME HAVING A FEEDTHROUGH STRUCTURE

Patent #:	7380459	Issue Dt:	06/03/2008	Application #:	11654292	Filing Dt:	01/16/2007
Title:	ABSOLUTE PRESSURE SENSOR

Patent #:	7436494	Issue Dt:	10/14/2008	Application #:	11706724	Filing Dt:	02/15/2007
Title:	THREE-DIMENSIONAL LADAR MODULE WITH ALIGNMENT REFERENCE INSERT CIRCUITRY

Patent #:	7990727	Issue Dt:	08/02/2011	Application #:	11731154	Filing Dt:	03/31/2007
Title:	BALL GRID ARRAY STACK

Patent #:	7755048	Issue Dt:	07/13/2010	Application #:	11807671	Filing Dt:	05/30/2007
Publication #:	US20100031992	Pub Dt:	02/11/2010
Title:	LARGE FORMAT THERMOELECTRIC INFRARED DETECTOR AND METHOD OF FABRICATION

Patent #:	7649386	Issue Dt:	01/19/2010	Application #:	11897938	Filing Dt:	08/31/2007
Publication #:	US20080074144	Pub Dt:	03/27/2008
Title:	FIELD PROGRAMMABLE GATE ARRAY UTILIZING DEDICATED MEMORY STACKS IN A VERTICAL LAYER FORMAT

Patent #:	7772045	Issue Dt:	08/10/2010	Application #:	11977447	Filing Dt:	10/24/2007
Title:	WIRE BOND METHOD FOR ANGULARLY DISPOSED CONDUCTIVE PADS AND A DEVICE MADE FROM THE METHOD

Patent #:	8485793	Issue Dt:	07/16/2013	Application #:	12283746	Filing Dt:	09/15/2008
Title:	CHIP SCALE VACUUM PUMP

Patent #:	8198576	Issue Dt:	06/12/2012	Application #:	12287691	Filing Dt:	10/10/2008
Publication #:	US20090079956	Pub Dt:	03/26/2009
Title:	THREE-DIMENSIONAL LADAR MODULE WITH ALIGNMENT REFERENCE INSERT CIRCUITRY COMPRISING HIGH DENSITY INTERCONNECT STRUCTURE

Patent #:	8040022	Issue Dt:	10/18/2011	Application #:	12334383	Filing Dt:	12/12/2008
Publication #:	US20090167114	Pub Dt:	07/02/2009
Title:	FORCED VIBRATION PIEZO GENERATOR AND PIEZO ACTUATOR

Patent #:	RE43536	Issue Dt:	07/24/2012	Application #:	12500434	Filing Dt:	07/09/2009
Title:	STACKABLE LAYER CONTAINING BALL GRID ARRAY PACKAGE

Patent #:	RE43722	Issue Dt:	10/09/2012	Application #:	12607253	Filing Dt:	10/28/2009
Title:	THREE-DIMENSIONAL LADAR MODULE WITH ALIGNMENT REFERENCE INSERT CIRCUITRY

Patent #:	7902879	Issue Dt:	03/08/2011	Application #:	12639625	Filing Dt:	12/16/2009
Publication #:	US20100148822	Pub Dt:	06/17/2010
Title:	FIELD PROGRAMMABLE GATE ARRAY UTILIZING DEDICATED MEMORY STACKS IN A VERTICAL LAYER FORMAT

Patent #:	8299594	Issue Dt:	10/30/2012	Application #:	12696185	Filing Dt:	01/29/2010
Publication #:	US20100140777	Pub Dt:	06/10/2010
Title:	STACKED BALL GRID ARRAY PACKAGE MODULE UTILIZING ONE OR MORE INTERPOSER LAYERS

Patent #:	RE43877	Issue Dt:	12/25/2012	Application #:	12712810	Filing Dt:	02/25/2010
Title:	METHOD FOR PRECISION INTEGRATED CIRCUIT DIE SINGULATION USING DIFFERENTIAL ETCH RATES

Patent #:	7982300	Issue Dt:	07/19/2011	Application #:	12731970	Filing Dt:	03/25/2010
Publication #:	US20100181662	Pub Dt:	07/22/2010
Title:	STACKABLE LAYER CONTAINING BALL GRID ARRAY PACKAGE

Patent #:	8012803	Issue Dt:	09/06/2011	Application #:	12891439	Filing Dt:	09/27/2010
Publication #:	US20110045635	Pub Dt:	02/24/2011
Title:	VERTICALLY STACKED PRE-PACKAGED INTEGRATED CIRCUIT CHIPS

Patent #:	8835218	Issue Dt:	09/16/2014	Application #:	13181221	Filing Dt:	07/12/2011
Publication #:	US20110269270	Pub Dt:	11/03/2011
Title:	STACKABLE LAYER CONTAINING BALL GRID ARRAY PACKAGE

Assignor

APROLASE DEVELOPMENT CO., LLC

Exec Dt:

08/26/2015

Assignee

NYTELL SOFTWARE LLC

2711 CENTERVILLE RD

SUITE 400

WILMINGTON, DELAWARE 19808

Correspondence name and address
	FOLEY & LARDNER LLP
	150 EAST GILMAN STREET
	VEREX PLAZA
	MADISON, WI 53703

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