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Patent Assignment Details
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Reel/Frame:028118/0201   Pages: 6
Recorded: 04/27/2012
Attorney Dkt #:6657-52600
Conveyance: ASSIGNMENT EFFECTIVE 11/30/2011
Total properties: 6
1
Patent #:
Issue Dt:
05/04/2004
Application #:
10330067
Filing Dt:
12/30/2002
Title:
CHIP AND DEFECT TOLERANT METHOD OF MOUNTING SAME TO A SUBSTRATE
2
Patent #:
Issue Dt:
11/16/2004
Application #:
10330232
Filing Dt:
12/30/2002
Title:
CONNECTOR FOR TRANSPORTING SIGNALS BETWEEN CONTACT PADS ON TWO SURFACES
3
Patent #:
Issue Dt:
10/09/2007
Application #:
10330234
Filing Dt:
12/30/2002
Title:
MICROELECTRONIC COMPLEX HAVING CLUSTERED CONDUCTIVE MEMBERS
4
Patent #:
Issue Dt:
06/27/2006
Application #:
10330319
Filing Dt:
12/30/2002
Title:
HIGH-DENSITY ARCHITECTURE FOR A MICROELECTRONIC COMPLEX ON A PLANAR BODY
5
Patent #:
Issue Dt:
04/12/2005
Application #:
10606886
Filing Dt:
06/27/2003
Publication #:
Pub Dt:
01/01/2004
Title:
FLEXIBLE CONNECTING DEVICE FOR INTERFACING WITH A WAFER
6
Patent #:
Issue Dt:
01/30/2007
Application #:
10677333
Filing Dt:
10/03/2003
Title:
CONNECTOR WITH FAULT TOLERANCE
Assignor
1
Exec Dt:
04/20/2012
Assignee
1
4028 MARLOWE AVENUE
MONTREAL, QUEBEC, CANADA H4A3M2
Correspondence name and address
DAWN DELUCA
1120 SOUTH CAPITAL OF TEXAS HIGHWAY
BUILDING 2, SUITE 300
AUSTIN, TX 78746

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