Patent Assignment Details
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Reel/Frame: | 052813/0203 | |
| Pages: | 6 |
| | Recorded: | 06/02/2020 | | |
Attorney Dkt #: | 17612-000041-US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/12/2022
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Application #:
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16885933
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Filing Dt:
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05/28/2020
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Publication #:
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Pub Dt:
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04/29/2021
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Title:
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THREE-DIMENSIONAL SEMICONDUCTOR DEVICE INCLUDING A THROUGH-VIA STRUCTURE HAVING A VIA LINER HAVING PROTRUDING PORTIONS
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Assignee
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129, SAMSUNG-RO, YEONGTONG-GU |
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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Correspondence name and address
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HARNESS, DICKEY & PIERCE, P.L.C.
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P.O. BOX 8910
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JOHN A. CASTELLANO
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RESTON, VA 20195
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