Patent Assignment Details
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Reel/Frame: | 061806/0205 | |
| Pages: | 3 |
| | Recorded: | 11/17/2022 | | |
Conveyance: | NUNC PRO TUNC ASSIGNMENT (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/22/2020
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Application #:
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16507272
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Filing Dt:
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07/10/2019
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Publication #:
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Pub Dt:
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10/31/2019
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Title:
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METHOD OF ETCHING MICROELECTRONIC MECHANICAL SYSTEM FEATURES IN A SILICON WAFER
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Assignee
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1-1, SHOWA-CHO |
KARIYA-CITY, AICHI-PREF, JAPAN 448-8661 |
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Correspondence name and address
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CPA GLOBAL
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CASTLE STREET , LIBERATION HOUSE
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ST HELIER, JERSEY, JE1 1BL JERSEY
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06/18/2024 02:24 AM
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