Patent Assignment Details
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| Reel/Frame: | 040868/0207 | |
| Pages: | 5 |
| | Recorded: | 01/06/2017 | | |
| Attorney Dkt #: | WUWE3038/EM |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15399797
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Filing Dt:
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01/06/2017
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Publication #:
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Pub Dt:
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06/14/2018
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Title:
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FLIP-CHIP PACKAGING DIODE WITH A MULTICHIP STRUCTURE
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Assignee
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| 5F, NO. 208, SEC. 3, CHUNG YANG RD. |
| TUCHENG DIST. |
| NEW TAIPEI CITY, TAIWAN 236 |
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Correspondence name and address
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BACON & THOMAS, PLLC
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625 SLATERS LANE
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FOURTH FLOOR
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ALEXANDRIA, VA 22314-1176
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