Patent Assignment Details
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Reel/Frame: | 017331/0208 | |
| Pages: | 2 |
| | Recorded: | 03/20/2006 | | |
Attorney Dkt #: | 3002.0017C |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11337084
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Filing Dt:
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01/23/2006
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Publication #:
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Pub Dt:
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07/20/2006
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Title:
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Electronic component with semiconductor chip and semiconductor wafer with contact pads, and method for the production thereof
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Assignee
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ST.-MARTIN-STR. 53 |
MUNICH, GERMANY 81669 |
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Correspondence name and address
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ANDREW J. ALDAG - ESF, LLC
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1901 RESEARCH BLVD.
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SUITE 400
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ROCKVILLE, MD 20850
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