Patent Assignment Details
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| Reel/Frame: | 064519/0208 | |
| Pages: | 3 |
| | Recorded: | 08/08/2023 | | |
| Attorney Dkt #: | TSMCP1359USA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18366844
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Filing Dt:
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08/08/2023
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Publication #:
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Pub Dt:
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12/07/2023
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Title:
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BOND PAD STRUCTURE COUPLED TO MULTIPLE INTERCONNECT CONDUCTIVE\ STRUCTURES THROUGH TRENCH IN SUBSTRATE
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Assignee
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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ESCHWEILER & POTASHNIK
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195 S. MAIN ST., SUITE 400
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AKRON, OH 44308
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05/29/2024 01:42 PM
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