Patent Assignment Details
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Reel/Frame: | 060530/0210 | |
| Pages: | 4 |
| | Recorded: | 06/29/2022 | | |
Attorney Dkt #: | C64-030210 US PCT |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/07/2023
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Application #:
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17258577
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Filing Dt:
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01/07/2021
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Publication #:
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Pub Dt:
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06/03/2021
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Title:
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SEMICONDUCTOR DEVICE SUB-ASSEMBLY
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Assignees
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DODDINGTON ROAD |
LINCOLN |
LINCOLNSHIRE, UNITED KINGDOM LNS 3LF |
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SHIDAI ROAD |
SHIFENG DISTRICT, ZHUZHOU |
HUNAN, CHINA 412001 |
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Correspondence name and address
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CRAIG W. HAYDEN
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1300 EAST 9TH STREET
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SUITE 1700
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CLEVELAND, OH 44114
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