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Reel/Frame:060530/0210   Pages: 4
Recorded: 06/29/2022
Attorney Dkt #:C64-030210 US PCT
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
02/07/2023
Application #:
17258577
Filing Dt:
01/07/2021
Publication #:
Pub Dt:
06/03/2021
Title:
SEMICONDUCTOR DEVICE SUB-ASSEMBLY
Assignor
1
Exec Dt:
01/07/2021
Assignees
1
DODDINGTON ROAD
LINCOLN
LINCOLNSHIRE, UNITED KINGDOM LNS 3LF
2
SHIDAI ROAD
SHIFENG DISTRICT, ZHUZHOU
HUNAN, CHINA 412001
Correspondence name and address
CRAIG W. HAYDEN
1300 EAST 9TH STREET
SUITE 1700
CLEVELAND, OH 44114

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