Patent Assignment Details
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Reel/Frame: | 005817/0212 | |
| Pages: | 5 |
| | Recorded: | 08/12/1991 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/28/1992
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Application #:
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07745139
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Filing Dt:
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08/12/1991
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Title:
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METHOD OF BONDING FLEXIBLE CIRCUIT TO CIRCUITIZED SUBSTRATE TO PROVIDE ELECTRICAL CONNECTION THEREBETWEEN
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Correspondence name and address
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LAWRENCE R. FRALEY
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INTERNATIONAL BUSINESS MACHINES CORP.
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INTELLECTUAL PROPERTY LAW N50/251-2
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1701 N. ST.
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ENDICOTT, NY 13760
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