Patent Assignment Details
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Reel/Frame: | 011924/0212 | |
| Pages: | 5 |
| | Recorded: | 06/18/2001 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/17/2002
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Application #:
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09884348
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Filing Dt:
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06/18/2001
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Publication #:
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Pub Dt:
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10/18/2001
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Title:
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HEAT SINK ASSEMBLY FOR DISSIPATING HEAT OF AN ELECTRONIC PACKAGE MOUNTED ON AN ELECTRICAL SOCKET
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Assignee
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66-1 CHUNG SHAN ROAD |
TU-CHEN, TAIPEI HSIEN, TAIWAN |
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Correspondence name and address
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WEI TE (JOSEPH) CHUNG, FOXCONN INTL.INC.
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1650 MEMOREX DRIVE
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SANTA CLARA, CA 95050
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Domestic representative
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(FOXCONN INTERNATIONAL, INC.)
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WEI TE CHUNG
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1650 MEMOREX DRIVE
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SANTA CLARA, CA 95050
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