Patent Assignment Details
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Reel/Frame: | 059476/0212 | |
| Pages: | 3 |
| | Recorded: | 04/01/2022 | | |
Attorney Dkt #: | 2021-2181/24061.4483US01 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17711705
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Filing Dt:
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04/01/2022
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Publication #:
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Pub Dt:
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01/26/2023
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Title:
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Semiconductor Device And Method Of Manufacturing The Same
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Assignee
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8, LI-HSIN RD. 6 |
HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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HAYNES AND BOONE, LLP (24061) IP SECTION
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2323 VICTORY AVENUE
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SUITE 700
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DALLAS, 75219 UNITED STATES
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09/26/2024 05:31 AM
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