Patent Assignment Details
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Reel/Frame: | 005220/0216 | |
| Pages: | 4 |
| | Recorded: | 01/24/1990 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/19/1991
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Application #:
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07469110
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Filing Dt:
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01/24/1990
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Title:
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DRY INTERFACE THERMAL CHUCK TEMPERATURE CONTROL SYSTEM FOR SEMICONDUCTOR WAFER TESTING
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Assignee
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A CORP. OF NY |
ARMONK, NEW YORK |
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Correspondence name and address
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JOHN W. HENDERSON, JR.
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INTELLECTUAL PROP. LAW
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IBM CORP., DEPT. 901
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BUILDING 300-482, ROUTE 52
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HOPEWELL JUNCTION, NY 12533-9988
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