Patent Assignment Details
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Reel/Frame: | 010015/0218 | |
| Pages: | 3 |
| | Recorded: | 05/26/1999 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/26/2001
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Application #:
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09318597
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Filing Dt:
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05/26/1999
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Title:
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METHOD OF TESTING AND PACKAGING A SEMICONDUCTOR CHIP
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Assignee
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SCIENCE-BASED INDUSTRIAL PARK |
NO. 3, LI-HSIN ROAD 2 |
HSIN-CHU, TAIWAN R.O.C |
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Correspondence name and address
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WINSTON HSU
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3F, NO. 52, LANE 46, MIN-SHENG ROAD
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YUNG-HO CITY, TAIPEI HSIEN
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TAIWAN, R.O.C.
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