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Total properties:
13
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Patent #:
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Issue Dt:
|
09/07/2021
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Application #:
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16456884
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Filing Dt:
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06/28/2019
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Publication #:
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Pub Dt:
|
10/24/2019
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Title:
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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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Patent #:
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|
Issue Dt:
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04/20/2021
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Application #:
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16564814
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Filing Dt:
|
09/09/2019
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Publication #:
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Pub Dt:
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01/02/2020
| | | | |
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Title:
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SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACTURING METHOD THEREOF
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|
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16583632
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Filing Dt:
|
09/26/2019
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Publication #:
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Pub Dt:
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04/23/2020
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Title:
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METHOD OF FORMING A SEMICONDUCTOR DEVICE INCLUDING FORMING AN EMI SHIELDING LAYER OVER THE SEMICONDUCTOR DEVICE ATTACHED TO A TAPE VIA ADHESIVE
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Patent #:
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Issue Dt:
|
06/08/2021
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Application #:
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16707411
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Filing Dt:
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12/09/2019
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Publication #:
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Pub Dt:
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06/11/2020
| | | | |
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Title:
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SEMICONDUCTOR PACKAGE STRUCTURE FOR IMPROVING DIE WARPAGE AND MANUFACTURING METHOD THEREOF
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Patent #:
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Issue Dt:
|
07/27/2021
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Application #:
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16777519
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Filing Dt:
|
01/30/2020
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Publication #:
|
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Pub Dt:
|
07/30/2020
| | | | |
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Title:
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Semiconductor Package With EMI Shield and Fabricating Method Thereof
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|
|
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Patent #:
|
|
Issue Dt:
|
06/08/2021
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Application #:
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16887590
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Filing Dt:
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05/29/2020
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Publication #:
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Pub Dt:
|
09/17/2020
| | | | |
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Title:
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SEMICONDUCTOR DEVICE WITH TIERED PILLAR AND MANUFACTURING METHOD THEREOF
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|
|
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Patent #:
|
|
Issue Dt:
|
08/09/2022
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Application #:
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16889971
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Filing Dt:
|
06/02/2020
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Publication #:
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Pub Dt:
|
09/24/2020
| | | | |
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Title:
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SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS
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|
|
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Patent #:
|
|
Issue Dt:
|
08/23/2022
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Application #:
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16890624
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Filing Dt:
|
06/02/2020
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Publication #:
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Pub Dt:
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11/19/2020
| | | | |
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Title:
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SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS ON PARTIAL ENCAPSULATION AND NON-PHOTOSENSITIVE PASSIVATION LAYERS
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|
|
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Patent #:
|
|
Issue Dt:
|
03/07/2023
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Application #:
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16921522
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Filing Dt:
|
07/06/2020
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Publication #:
|
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Pub Dt:
|
10/22/2020
| | | | |
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Title:
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SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DUMMY SUBSTRATES
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|
|
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Patent #:
|
|
Issue Dt:
|
08/23/2022
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Application #:
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16925546
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Filing Dt:
|
07/10/2020
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|
Publication #:
|
|
Pub Dt:
|
10/29/2020
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/01/2022
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Application #:
|
16943015
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Filing Dt:
|
07/30/2020
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|
Publication #:
|
|
Pub Dt:
|
11/12/2020
| | | | |
|
Title:
|
Method and System for Packing Optimization of Semiconductor Devices
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|
|
|
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Patent #:
|
|
Issue Dt:
|
09/06/2022
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Application #:
|
17026752
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Filing Dt:
|
09/21/2020
|
|
Publication #:
|
|
Pub Dt:
|
01/21/2021
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE WITH TRANSMISSIVE LAYER AND MANUFACTURING METHOD THEREOF
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|
|
|
|
Patent #:
|
NONE
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Issue Dt:
|
07/09/2024
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Application #:
|
17028329
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Filing Dt:
|
09/22/2020
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|
Publication #:
|
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Pub Dt:
|
01/21/2021
| | | | |
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Title:
|
WAFER-LEVEL STACK CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
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|
