Patent Assignment Details
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Reel/Frame: | 052326/0219 | |
| Pages: | 7 |
| | Recorded: | 04/07/2020 | | |
Attorney Dkt #: | UTACP2017NAT41US0 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/19/2020
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Application #:
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16057792
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Filing Dt:
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08/07/2018
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Publication #:
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Pub Dt:
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02/14/2019
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Title:
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SEMICONDUCTOR PACKAGE WITH A HEAT SPREADER AND METHOD OF MANUFACTURING THEREOF
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Assignee
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22 ANG MO KIO INDUSTRIAL PARK 2 |
SINGAPORE, SINGAPORE 569506 |
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Correspondence name and address
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HORIZON IP PTE LTD
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7500A BEACH ROAD
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#04-306/308 THE PLAZA
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SINGAPORE 199591, SINGAPORE
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