Patent Assignment Details
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Reel/Frame: | 020618/0220 | |
| Pages: | 3 |
| | Recorded: | 02/26/2008 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/24/2012
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Application #:
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12072401
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Filing Dt:
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02/26/2008
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Publication #:
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Pub Dt:
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08/28/2008
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Title:
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STACKED SEMICONDUCTOR CHIP PACKAGE WITH SHARED DLL SIGNAL AND METHOD FOR FABRICATING STACKED SEMICONDUCTOR CHIP PACKAGE WITH SHARED DLL SIGNAL
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Assignee
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416, MAETAN-DONG |
YEONGTONG-GU |
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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ANTHONY P. ONELLO, JR.
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MILLS & ONELLO LLP
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ELEVEN BEACON STREET, SUITE 605
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BOSTON, MASSACHUSETTS 02108
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