Patent Assignment Details
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| Reel/Frame: | 062299/0220 | |
| Pages: | 3 |
| | Recorded: | 01/06/2023 | | |
| Attorney Dkt #: | 15570003US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18004528
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Filing Dt:
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01/06/2023
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Publication #:
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Pub Dt:
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08/03/2023
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Title:
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E-LIQUID FILLING STRUCTURE AND ASSEMBLY AND E-LIQUID INJECTION METHOD
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Assignee
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| BLOCK 1, SHAPU YANGYONG INDUSTRY PARK, SONGGANG, BAO'AN DISTRICT |
| SHENZHEN, GUANGDONG, CHINA |
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Correspondence name and address
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MAIER & MAIER, PLLC
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345 SOUTH PATRICK STREET
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ALEXANDRIA, VA 22314
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06/28/2024 03:16 AM
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