Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 014420/0221 | |
| Pages: | 7 |
| | Recorded: | 03/12/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
10
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/12/1991
|
Application #:
|
07674180
|
Filing Dt:
|
03/25/1991
|
|
Title:
|
PACKAGE FOR SPOOLED PRODUCTS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/02/1994
|
Application #:
|
08014201
|
Filing Dt:
|
02/05/1993
|
|
Title:
|
NO-CLEAN, LOW-RESIDUE, VOLATILE ORGANIC COMPOUND FREE SOLDERING FLUX AND METHOD OF USE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/25/1994
|
Application #:
|
08014203
|
Filing Dt:
|
02/05/1993
|
|
Title:
|
NO-CLEAN, LOW-RESIDUE, VOLATILE ORGANIC COMPOUND FREE SOLDERING FLUX AND METHOD OF USE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/09/2006
|
Application #:
|
08644912
|
Filing Dt:
|
05/28/1996
|
|
Title:
|
ENCAPSULANT WITH FLUXING PROPERTIES AND METHOD OF USE IN FLIP-CHIP SURFACE MOUNT REFLOW SOLDERING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/09/2002
|
Application #:
|
09148506
|
Filing Dt:
|
09/04/1998
|
|
Title:
|
SOLDER FLUX COMPATIBLE WITH FLIP-CHIP UNDERFILL MATERIAL
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/09/2003
|
Application #:
|
10051661
|
Filing Dt:
|
01/18/2002
|
|
Publication #:
|
|
Pub Dt:
|
07/25/2002
| | | | |
|
Title:
|
SOLDER FLUX COMPATIBLE WITH FLIP-CHIP UNDERFILL MATERIAL
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/07/2004
|
Application #:
|
10271883
|
Filing Dt:
|
10/16/2002
|
|
Publication #:
|
|
Pub Dt:
|
04/22/2004
| | | | |
|
Title:
|
METHOD OF CONTROLLING SOLDER DEPOSITION UTILIZING TWO FLUXES AND PREFORM
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/16/2004
|
Application #:
|
10361390
|
Filing Dt:
|
02/10/2003
|
|
Publication #:
|
|
Pub Dt:
|
09/18/2003
| | | | |
|
Title:
|
ENCAPSULANT WITH FLUXING PROPERTIES AND METHOD OF USE IN FLIP-CHIP SURFACE MOUNT REFLOW SOLDERING
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
10361671
|
Filing Dt:
|
02/10/2003
|
|
Publication #:
|
|
Pub Dt:
|
09/18/2003
| | | | |
|
Title:
|
Encapsulant with fluxing properties and method of use in flip-chip surface mount reflow soldering
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
10682669
|
Filing Dt:
|
10/09/2003
|
|
Publication #:
|
|
Pub Dt:
|
04/14/2005
| | | | |
|
Title:
|
Surface reactive preservative for use with solder preforms
|
|
|
Assignee
|
|
|
|
|
| 515 EAST TOUHY AVENUE |
| DES PLAINES, ILLINOIS 60018 |
|
|
Correspondence name and address
|
| |
LADAS & PARRY
|
| |
BRIAN W. HAMEDER
|
| |
224 SOUTH MICHIGAN AVENUE
|
| |
CHICAGO, IL 60604
|
Search Results as of:
06/26/2024 10:51 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
