Patent Assignment Details
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| Reel/Frame: | 053770/0221 | |
| Pages: | 5 |
| | Recorded: | 09/15/2020 | | |
| Attorney Dkt #: | LIPOP403US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/23/2021
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Application #:
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17020984
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Filing Dt:
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09/15/2020
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Publication #:
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Pub Dt:
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04/01/2021
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Title:
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FLIP-CHIP PACKAGE SUBSTRATE AND METHOD FOR FABRICATING THE SAME
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Assignee
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| NO. 458-17, XINXING RD. |
| HUKOU TOWNSHIP |
| HSINCHU COUNTY, TAIWAN 30353 |
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Correspondence name and address
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AMIN, TUROCY & WATSON, LLP
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200 PARK AVENUE
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SUITE 300
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BEACHWOOD, OH 44122
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