Patent Assignment Details
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| Reel/Frame: | 049798/0222 | |
| Pages: | 6 |
| | Recorded: | 07/19/2019 | | |
| Attorney Dkt #: | 008687.00006 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/23/2021
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Application #:
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16464896
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Filing Dt:
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05/29/2019
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Publication #:
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Pub Dt:
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09/19/2019
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Title:
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Integrated Circuit Packaging Structure and Method
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Assignee
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| ROOM 601, BUILDING 2, ZHONGJIAN INDUSTRIAL BLDG. |
| NO. 18 YANSHAN ROAD, SHEKOU STREET, NANSHAN DISTR. |
| SHENZHEN, GUANGDONG, CHINA 518067 |
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Correspondence name and address
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BANNER & WITCOFF, LTD.
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1100 13TH ST. NW
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STE 1200
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WASHINGTON, DC 20005
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