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Total properties:
21
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Patent #:
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Issue Dt:
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05/12/1992
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Application #:
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07580505
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Filing Dt:
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09/13/1990
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Title:
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METHOD OF MAKING METAL-FILM LAMINATE RESISTANT TO DELAMINATION
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Patent #:
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Issue Dt:
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08/11/1992
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Application #:
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07681073
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Filing Dt:
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04/05/1991
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Title:
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METAL-FILM LAMINATE RESISTANT TO DELAMINATION
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Patent #:
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Issue Dt:
|
07/28/1992
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Application #:
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07740931
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Filing Dt:
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08/06/1991
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Title:
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SURFACE MOUNTED COMPONENTS ON FLEX CIRCUITS
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Patent #:
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Issue Dt:
|
11/15/1994
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Application #:
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07909058
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Filing Dt:
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08/04/1992
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Title:
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METAL-FILM LAMINATE RESISTANT TO DELAMINATION
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Patent #:
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Issue Dt:
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11/16/1993
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Application #:
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07932064
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Filing Dt:
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08/19/1992
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Title:
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DIRECT APPLICATION OF UNPACKAGED INTEGRATED CIRCUIT TO FLEXIBLE PRINTED CIRCUIT
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Patent #:
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Issue Dt:
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09/20/1994
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Application #:
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08081544
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Filing Dt:
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06/23/1993
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Title:
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DIRECT APPLICATION OF UNPACKAGED INTEGRATED CIRCUIT TO FLEXIBLE PRINTED CIRCUIT
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Patent #:
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Issue Dt:
|
06/18/1996
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Application #:
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08142243
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Filing Dt:
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10/22/1993
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Title:
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FLEXIBLE MULTILAYER PRINTED CIRCUIT BOARDS AND METHODS OF MANUFACTURE
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Patent #:
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Issue Dt:
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01/20/1998
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Application #:
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08327236
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Filing Dt:
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10/21/1994
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Title:
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PRINTED WIRING BOARD WITH PHOTOIMAGEABLE DIELECTRIC BASE SUBSTRATE AND METHOD OF MANUFACTURE THEREFOR
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Patent #:
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Issue Dt:
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01/02/1996
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Application #:
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08339029
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Filing Dt:
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11/14/1994
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Title:
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METAL-FILM LAMINATE RESISTANT TO DELAMINATION
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Patent #:
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Issue Dt:
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11/18/1997
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Application #:
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08534630
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Filing Dt:
|
09/27/1995
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Title:
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MULTILAYER ELECTRONIC CIRCUIT HAVING A CONDUCTIVE ADHESIVE
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|
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Patent #:
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Issue Dt:
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09/01/1998
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Application #:
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08543623
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Filing Dt:
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10/16/1995
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Title:
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FLEXIBLE MULTILAYER PRINTED CIRCUIT BOARDS AND METHODS OF MANUFACTURE
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Patent #:
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|
Issue Dt:
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04/01/1997
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Application #:
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08644585
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Filing Dt:
|
05/10/1996
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Title:
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METHOD FOR INTERCONNECTING A FLIP CHIP TO A PRINTED CIRCUIT SUBSTRATE
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Patent #:
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Issue Dt:
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07/27/1999
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Application #:
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08646522
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Filing Dt:
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05/07/1996
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Title:
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HEAT SINK STRUCTURE COMPRISING A MICROARRAY OF THERMAL METAL HEAT CHANNELS OR VIAS IN A POLYMERIC OR FILM LAYER
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Patent #:
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Issue Dt:
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03/17/1998
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Application #:
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08661809
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Filing Dt:
|
06/11/1996
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|
Title:
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METHOD OF MANUFACTURING A MULTILAYER ELECTRONIC CIRCUIT
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|
|
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Patent #:
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|
Issue Dt:
|
08/25/1998
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Application #:
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08675564
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Filing Dt:
|
07/03/1996
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Title:
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ADHERENT FILM WITH LOW THERMAL IMPEDANCE AND HIGH ELECTRICAL IMPEDANCE USED IN AN ELECTRONIC ASSEMBLY WITH A HEAT SINK
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Patent #:
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Issue Dt:
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02/17/1998
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Application #:
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08685425
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Filing Dt:
|
09/26/1994
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Title:
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PRINTED CIRCUIT ASSEMBLY WITH FINE PITCH FLEXIBLE PRINTED CIRCUIT OVERLAY MOUNTED TO PRINTED CIRCUIT BOARD
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|
|
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Patent #:
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Issue Dt:
|
06/16/1998
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Application #:
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08743661
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Filing Dt:
|
11/05/1996
|
|
Title:
|
ADHERENT FILM WITH LOW THERMAL IMPEDANCE AND HIGH ELECTRICAL IMPEDANCE USED IN AN ELECTRONIC ASSEMBLY WITH A HEAT SINK
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|
|
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Patent #:
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|
Issue Dt:
|
05/09/2000
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Application #:
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08891113
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Filing Dt:
|
07/10/1997
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|
Title:
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METAL-FILM LAMINATE RESISTANT TO DELAMINATION
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|
|
|
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Patent #:
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|
Issue Dt:
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08/15/2000
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Application #:
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09014026
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Filing Dt:
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01/27/1998
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|
Title:
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CHARGE TRANSFER LOAD SENSOR
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|
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Patent #:
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|
Issue Dt:
|
05/08/2001
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Application #:
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09070505
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Filing Dt:
|
04/30/1998
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Title:
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PRINTED CIRCUIT BOARD ASSEMBLY USING A UNIQUE COOPERATIVE BONDING AND CONNECTING SYSTEM
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|
|
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Patent #:
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Issue Dt:
|
05/07/2002
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Application #:
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09804132
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Filing Dt:
|
03/12/2001
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Title:
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PRINTED CIRCUIT BOARD ASSEMBLY HAVING ADHESIVE JOINT
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