Patent Assignment Details
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| Reel/Frame: | 027059/0223 | |
| Pages: | 4 |
| | Recorded: | 10/13/2011 | | |
| Attorney Dkt #: | APOM066 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/16/2013
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Application #:
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13273168
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Filing Dt:
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10/13/2011
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Publication #:
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Pub Dt:
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04/18/2013
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Title:
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WAFER LEVEL PACKAGING METHOD OF ENCAPSULATING THE BOTTOM AND SIDE OF A SEMICONDUCTOR CHIP
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Assignee
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| 475 OAKMEAD PKWY |
| SUNNYVALE, CALIFORNIA 94085 |
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Correspondence name and address
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CHEIN-HWA S. TSAO
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6684 MT PAKRON DRIVE
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SAN JOSE, CA 95120
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