Patent Assignment Details
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Reel/Frame: | 057944/0223 | |
| Pages: | 2 |
| | Recorded: | 10/28/2021 | | |
Attorney Dkt #: | FOUND-39984-251 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17603541
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Filing Dt:
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10/13/2021
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Publication #:
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Pub Dt:
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08/24/2023
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Title:
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Fin-Shaped Semiconductor Device, Fabrication Method, and Application Thereof
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Assignee
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ROOM 139, BULDING 19, 30 CHANGLING ROAD |
HUANGPU DISTRICT, GUANGZHOU |
GUANGDONG, CHINA 510700 |
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Correspondence name and address
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TYLER J SISK
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2275 DEMING WAY SUITE 310
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MIDDLETON, WI 53562
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06/25/2024 10:07 AM
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