Patent Assignment Details
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| Reel/Frame: | 014509/0224 | |
| Pages: | 2 |
| | Recorded: | 09/16/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/07/2004
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Application #:
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10662432
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Filing Dt:
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09/16/2003
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Title:
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FLIP CHIP PACKAGE STRUCTURE FOR AN IMAGE SENSOR AND AN IMAGE SENSE MODULE WITH THE FLIP CHIP PACKAGE STRUCTURE
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Assignee
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| NO. 258, YUNG YI RD., TAI-PING CITY |
| TAICHUNG HSIEN, TAIWAN R.O.C. |
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Correspondence name and address
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CHEN WEN CHING
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P.O. BOX 2103
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TAICHUNG, TAIWAN, REPUBLIC OF CHINA
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