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Reel/Frame:	044442/0224			Pages:	5
		Recorded:	12/19/2017
Attorney Dkt #:	UTACS2015SVE103
Conveyance:	CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).

Total properties: 34

Patent #:	6190943	Issue Dt:	02/20/2001	Application #:	09589197	Filing Dt:	06/08/2000
Title:	Chip scale packaging method

Patent #:	6326700	Issue Dt:	12/04/2001	Application #:	09639202	Filing Dt:	08/15/2000
Title:	Low profile semiconductor package and process for making the same

Patent #:	6683386	Issue Dt:	01/27/2004	Application #:	09837804	Filing Dt:	04/18/2001
Publication #:	US20020047200	Pub Dt:	04/25/2002
Title:	LOW PROFILE OPTICALLY-SENSITIVE SEMICONDUCTOR PACKAGE

Patent #:	6459163	Issue Dt:	10/01/2002	Application #:	09974871	Filing Dt:	10/12/2001
Publication #:	US20020135080	Pub Dt:	09/26/2002
Title:	SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING SAME

Patent #:	6638438	Issue Dt:	10/28/2003	Application #:	09977654	Filing Dt:	10/16/2001
Publication #:	US20030071013	Pub Dt:	04/17/2003
Title:	PRINTED CIRCUIT BOARD MICRO HOLE PROCESSING METHOD

Patent #:	6555919	Issue Dt:	04/29/2003	Application #:	10127918	Filing Dt:	04/23/2002
Title:	LOW PROFILE STACK SEMICONDUCTOR PACKAGE

Patent #:	6683385	Issue Dt:	01/27/2004	Application #:	10127983	Filing Dt:	04/23/2002
Publication #:	US20030197282	Pub Dt:	10/23/2003
Title:	LOW PROFILE STACK SEMICONDUCTOR PACKAGE

Patent #:	6614660	Issue Dt:	09/02/2003	Application #:	10134487	Filing Dt:	04/30/2002
Title:	THERMALLY ENHANCED IC CHIP PACKAGE

Patent #:	6753480	Issue Dt:	06/22/2004	Application #:	10153852	Filing Dt:	05/24/2002
Publication #:	US20030070835	Pub Dt:	04/17/2003
Title:	PRINTED CIRCUIT BOARD HAVING PERMANENT SOLDER MASK

Patent #:	6740540	Issue Dt:	05/25/2004	Application #:	10170664	Filing Dt:	06/12/2002
Publication #:	US20030173331	Pub Dt:	09/18/2003
Title:	FABRICATION METHOD FOR CIRCUIT BOARD

Patent #:	6709894	Issue Dt:	03/23/2004	Application #:	10170665	Filing Dt:	06/12/2002
Publication #:	US20030153123	Pub Dt:	08/14/2003
Title:	SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

Patent #:	6968613	Issue Dt:	11/29/2005	Application #:	10176122	Filing Dt:	06/20/2002
Publication #:	US20030182797	Pub Dt:	10/02/2003
Title:	FABRICATION METHOD OF CIRCUIT BOARD

Patent #:	6857865	Issue Dt:	02/22/2005	Application #:	10176145	Filing Dt:	06/20/2002
Publication #:	US20030235636	Pub Dt:	12/25/2003
Title:	MOLD STRUCTURE FOR PACKAGE FABRICATION

Patent #:	6859056	Issue Dt:	02/22/2005	Application #:	10176147	Filing Dt:	06/20/2002
Publication #:	US20030151420	Pub Dt:	08/14/2003
Title:	TEST FIXTURE FOR SEMICONDUCTOR PACKAGE AND TEST METHOD OF USING THE SAME

Patent #:	6897566	Issue Dt:	05/24/2005	Application #:	10179793	Filing Dt:	06/24/2002
Publication #:	US20030234442	Pub Dt:	12/25/2003
Title:	ENCAPSULATED SEMICONDUCTOR PACKAGE FREE OF CHIP CARRIER

Patent #:	6911604	Issue Dt:	06/28/2005	Application #:	10210091	Filing Dt:	08/02/2002
Publication #:	US20040020688	Pub Dt:	02/05/2004
Title:	BONDING PADS OF PRINTED CIRCUIT BOARD CAPABLE OF HOLDING SOLDER BALLS SECURELY

Patent #:	6790712	Issue Dt:	09/14/2004	Application #:	10214758	Filing Dt:	08/09/2002
Publication #:	US20020192860	Pub Dt:	12/19/2002
Title:	SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Patent #:	6849932	Issue Dt:	02/01/2005	Application #:	10232682	Filing Dt:	09/03/2002
Publication #:	US20040042140	Pub Dt:	03/04/2004
Title:	DOUBLE-SIDED THERMALLY ENHANCED IC CHIP PACKAGE

Patent #:	6713856	Issue Dt:	03/30/2004	Application #:	10232729	Filing Dt:	09/03/2002
Publication #:	US20040041249	Pub Dt:	03/04/2004
Title:	STACKED CHIP PACKAGE WITH ENHANCED THERMAL CONDUCTIVITY

Patent #:	6825064	Issue Dt:	11/30/2004	Application #:	10261796	Filing Dt:	09/30/2002
Publication #:	US20040061146	Pub Dt:	04/01/2004
Title:	MULTI-CHIP SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

Patent #:	6710434	Issue Dt:	03/23/2004	Application #:	10261833	Filing Dt:	09/30/2002
Publication #:	US20040061243	Pub Dt:	04/01/2004
Title:	WINDOW-TYPE SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

Patent #:	6822337	Issue Dt:	11/23/2004	Application #:	10261834	Filing Dt:	09/30/2002
Publication #:	US20040061239	Pub Dt:	04/01/2004
Title:	WINDOW-TYPE BALL GRID ARRAY SEMICONDUCTOR PACKAGE

Patent #:	6879030	Issue Dt:	04/12/2005	Application #:	10262309	Filing Dt:	09/30/2002
Publication #:	US20040061209	Pub Dt:	04/01/2004
Title:	STRENGTHENED WINDOW-TYPE SEMICONDUCTOR PACKAGE

Patent #:	6869824	Issue Dt:	03/22/2005	Application #:	10282473	Filing Dt:	10/29/2002
Publication #:	US20040082114	Pub Dt:	04/29/2004
Title:	FABRICATION METHOD OF WINDOW-TYPE BALL GRID ARRAY SEMICONDUCTOR PACKAGE

Patent #:	6713857	Issue Dt:	03/30/2004	Application #:	10314064	Filing Dt:	12/05/2002
Title:	STACKED MULTI-CHIP SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

Patent #:	6849915	Issue Dt:	02/01/2005	Application #:	10649847	Filing Dt:	08/26/2003
Title:	LIGHT SENSITIVE SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

Patent #:	6956741	Issue Dt:	10/18/2005	Application #:	10659528	Filing Dt:	09/09/2003
Publication #:	US20040184240	Pub Dt:	09/23/2004
Title:	SEMICONDUCTOR PACKAGE WITH HEAT SINK

Patent #:	6933448	Issue Dt:	08/23/2005	Application #:	10758426	Filing Dt:	01/16/2004
Publication #:	US20040149681	Pub Dt:	08/05/2004
Title:	PRINTED CIRCUIT BOARD HAVING PERMANENT SOLDER MASK

Patent #:	6933178	Issue Dt:	08/23/2005	Application #:	10829411	Filing Dt:	04/20/2004
Title:	METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES AND A CLAMPING DEVICE FOR MANUFACTURING A SEMICONDUCTOR PACKAGE

Patent #:	7224073	Issue Dt:	05/29/2007	Application #:	10848649	Filing Dt:	05/18/2004
Publication #:	US20050258544	Pub Dt:	11/24/2005
Title:	SUBSTRATE FOR SOLDER JOINT

Patent #:	6964888	Issue Dt:	11/15/2005	Application #:	10900134	Filing Dt:	07/28/2004
Publication #:	US20040266067	Pub Dt:	12/30/2004
Title:	SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Patent #:	7122407	Issue Dt:	10/17/2006	Application #:	10923748	Filing Dt:	08/24/2004
Publication #:	US20050208707	Pub Dt:	09/22/2005
Title:	METHOD FOR FABRICATING WINDOW BALL GRID ARRAY SEMICONDUCTOR PACKAGE

Patent #:	7091623	Issue Dt:	08/15/2006	Application #:	10980671	Filing Dt:	11/02/2004
Publication #:	US20050064631	Pub Dt:	03/24/2005
Title:	MULTI-CHIP SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

Patent #:	7951644	Issue Dt:	05/31/2011	Application #:	12579748	Filing Dt:	10/15/2009
Publication #:	US20100148361	Pub Dt:	06/17/2010
Title:	SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Assignor

ULTRATERA CORPORATION

Exec Dt:

04/26/2005

Assignee

UTAC (TAIWAN) CORPORATION

NO.2 LI-HSIN ROAD 3, SCIENCE BASED INDUSTRIAL PARK

HSINCHU, TAIWAN

Correspondence name and address
	HORIZON IP PTE. LTD.
	7500A BEACH ROAD, #04-306/308
	THE PLAZA
	SINGAPORE, 199591 SINGAPORE

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