Patent Assignment Details
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| Reel/Frame: | 032019/0225 | |
| Pages: | 3 |
| | Recorded: | 01/15/2014 | | |
| Attorney Dkt #: | IMB 24 US |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/21/2014
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Application #:
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12546454
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Filing Dt:
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08/24/2009
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Publication #:
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Pub Dt:
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02/25/2010
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Title:
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CIRCUIT BOARD STRUCTURE COMPRISING AN ELECTRICAL COMPONENT AND A METHOD FOR MANUFACTURING A CIRCUIT BOARD STRUCTURE COMPRISING AN ELECTRICAL COMPONENT
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Assignee
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| KUORTANEENKATU 2 |
| HELSINKI, FINLAND 00510 |
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Correspondence name and address
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SEPPO LAINE OY
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ITAMERENKATU 3 B
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HELESINKI, 00180 FINLAND
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