Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 067382/0225 | |
| Pages: | 8 |
| | Recorded: | 05/06/2024 | | |
| Attorney Dkt #: | ATJ CASES |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE CORRECTIVE ASSIGNMENT TO CORRECT THE PROPERTY NUMBERS SECTION TO REMOVE 14803889, 14850589, 14994963, 15010988, 15290577, 15364851, 15446426, 15472387, 15481848, 15493231, 16053965, 16661952, AND 1675920 PREVIOUSLY RECORDED ON REEL 055050 FRAME 0180. ASSIGNOR HEREBY CONFIRMS THE ASSIGNMENT OF PROPERTY 15366064. PREVIOUSLY RECORDED ON REEL 55050 FRAME 180. ASSIGNOR(S) HEREBY CONFIRMS THE CORRECTIVE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15366064
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Filing Dt:
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12/01/2016
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Publication #:
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Pub Dt:
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06/15/2017
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Title:
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WIRING SUBSTRATE, SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE, AND MANUFACTURING METHOD THEREOF
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Assignee
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| 491B RIVER VALLEY ROAD |
| VALLEY POINT #12-03, SINGAPORE 248373 |
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Correspondence name and address
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MR. KEVIN B JACKSON
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6315 E CACTUS WREN RD
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PARADISE VALLEY, AZ 85253
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