Patent Assignment Details
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Reel/Frame: | 010349/0226 | |
| Pages: | 3 |
| | Recorded: | 09/17/1999 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/26/2000
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Application #:
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09398732
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Filing Dt:
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09/17/1999
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Title:
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APPARATUS FOR PREVENTING PLASMA ETCHING Of A WAFER CLAMP IN SEMICONDUCTOR FABRICATION PROCESSES
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Assignee
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NO. 3, LI-HSIN RD. 2, SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU CITY, TAIWAN R.O.C |
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Correspondence name and address
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HARNESS, DICKEY & PIERCE, P.L.C.
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THOMAS T. MOGA
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P.O. BOX 828
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BLOOMFIELD, MI 48303
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